Example of VA / VE proposals

CERAMICS DESIGN LAB > Proposal for a transport End Effector / Handling Arm that can suck warped wafers

Proposal for a transport End Effector / Handling Arm that can suck warped wafers

  • Problems
    Warped Wafer
  • Proposed Effect
    Warped Wafer Prevention
    Misalignment Prevention
    Improved Functionality
  • Product Type
    Wafer Transfer End Effector / Handling Arm

Customer's concerns and problems / Before

A customer of a semiconductor/inspection equipment manufacturer asked us, “Can you suggest a End Effector that can transfer thin wafers and control wafer misalignment when transferring wafers from a wafer carrier during the wafer inspection process?”
They contacted us because we have lot of experience in manufacturing transfer End Effector !

Our proposals and improvement effects / After

Therefore, in the Ceramic Design Laboratory, we proposed the Bernoulli End Effector LeviZac, which can stably hold thin wafers and suppress wafer misalignment.
This time, I-shaped LeviZac ® was designed and proposed according to the customer’s application.
As a result, we were able to reduce damage to thin wafers due to insufficient wafer retention or vacuum leakage, and wafer scratches, breakage, and defects due to wafer misalignment, thereby improving yield.

  • Proposal for a transport End Effector / Handling Arm that can suck warped wafers|Ceramics Design Lab
  • Proposal for a transport End Effector / Handling Arm that can suck warped wafers|Ceramics Design Lab
  • Proposal for a transport End Effector / Handling Arm that can suck warped wafers|Ceramics Design Lab
  • Proposal for a transport End Effector / Handling Arm that can suck warped wafers|Ceramics Design Lab

Point of the proposed example / Point

The point of this case is that the thin wafer can be held stably and the misalignment of the wafer can be reduced.
When designing a transfer End Effector for thin wafers, it is necessary to design it considering reduction of suction shortage and vacuum leakage, etc.
Since the wafer is held by eight guides, the thin wafer can be held stably.
In addition, since the misalignment of the wafer can be prevented, there is no effect on the surrounding workpiece due to air leakage.


The Fine Ceramics Division of ASUZAC Corporation, which operates the Ceramic Design Laboratory, handles everything from material development and preparation to design and manufacture, as well as surface treatment, inspection, and cleaning.
We can also offer our own coating-technology for adding functionality to ceramics materials, as well as the selection of materials such as ceramic materials with high heat resistance and conductivity, and high-purity alumina and SiC that are highly pure and prevent contamination.
Contact a Tsubaki representative if you are having trouble transporting thin wafers or misalignment of wafers.

Integrated response from processing to development of ceramic materials !

Please feel free to contact us !

TEL +81-26-248-1626

Business hours: 9:00-17:00 (closed on Saturdays, Sundays and Holidays)

Examples of VA/VE proposals
for designers and developers

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  • Deformation
  • Cost
  • Particles
  • Conductivity
  • Suction Marks
  • Static Electricity
  • 大型偏光フィルムの吸着
  • Warped Wafer
  • Productivity (Throughput)
  • Impurities
  • Sparking
  • Wafer Scratching
  • Part Replacement Time
  • Outgassing
  • Surface Resistance
  • Wafer Sticking
  • Reflectance
  • Air-Permeability
  • Lint adhesion
  • Misalignment
  • Clogging
  • Plasma Resistance
  • Yield
  • Contact Damage
  • Product Life
  • Dust Emissions
  • Defect Rate
  • Heat Resistance
  • Contamination
  • Abrasion
  • Functionality
  • Chemical Resistance
  • Corrosion Resistance
  • 薄ウェハ

Part Replacement Time

薄ウェハ

  • 準備中です
  • Metal Contamination Control
  • Wear Resistance Improvement
  • Improved Functionality
  • Wafer Scratch Prevention
  • Anti-Static Measures
  • Improved Heat Resistance
  • Portability
  • Warped Wafer Prevention
  • Sparking Prevention
  • Improved Chemical Resistance
  • Improved Productivity
  • Misalignment Prevention
  • Reduced Defect Rate
  • Improved Productivity(Improved Throughput)
  • Wear Resistance
  • Contact Damage Reduction
  • Yield Improvement
  • Man-Hour Reduction
  • Surface Resistance Control
  • Wear Prevention
  • Particle Control
  • Suction Mark Reduction
  • Outgassing Reduction
  • Deformation Reduction
  • Improved Plasma Resistance
  • Long Service Life
  • ワークの傷防止
  • Contamination Measures
  • Cost Reduction

Improved Functionality

Improved Productivity(Improved Throughput)

Man-Hour Reduction

Cost Reduction

  • Wafer Transfer End Effector / Handling Arm
  • Baking Setter
  • Porous Chuck
  • Alumina Cover
  • PAD
  • Other

Wafer Transfer End Effector / Handling Arm

CONTACT

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