Example of VA / VE proposals

CERAMICS DESIGN LAB > Proposal of End Effector / Handling Arm for warping and thin wafer transfer

Proposal of End Effector / Handling Arm for warping and thin wafer transfer

  • Problems
    Particles
    Suction Marks
    Wafer Scratching
  • Proposed Effect
    Wafer Scratch Prevention
    Warped Wafer Prevention
    Suction Mark Reduction
    Yield Improvement
    Particle Control
  • Product Type
    Wafer Transfer End Effector / Handling Arm

Customer's concerns and problems / Before

Our customer had been searching for a solution because of the problem of sticking marks on the wafer.


If there is an adsorption mark on the wafer, particles will be generated, and the yield will be lowered.

Our proposals and improvement effects / After

In the past, suction-type Transfer End Effector / Handling Arm were used, but we proposed a porous embedded End Effector / Handling Arm with a coating treatment to prevent suction marks from sticking to the wafer.


Asuzac’s porous ceramics have a hole diameter of 30 to 40μm, which makes it difficult for the wafer to receive suction marks or scratches.


As a result of the customer’s use, it became difficult for the wafer to be attached with suction marks, contributing to the improvement of yield.

  • Proposal of End Effector / Handling Arm for warping and thin wafer transfer|Ceramics Design Lab
  • Proposal of End Effector / Handling Arm for warping and thin wafer transfer|Ceramics Design Lab
  • Proposal of End Effector / Handling Arm for warping and thin wafer transfer|Ceramics Design Lab
  • Proposal of End Effector / Handling Arm for warping and thin wafer transfer|Ceramics Design Lab

Point of the proposed example / Point

The point of this case is that we were able to improve productivity by changing the type of Transfer End Effector / Handling Arm, especially in important processes.


Changing the conveyance method entails risks, but it is possible to greatly achieve the results of new technological developments like porous ceramics, which evolve day by day.


In this case, the use of porous ceramics with fine pore diameters prevents scratches.


The Fine Ceramics Division of ASUZAC Corporation, which operates the Ceramics Design Laboratory, handles everything from material development and preparation to design and manufacture, as well as surface treatment, inspection, and cleaning.


We can also offer our own coating-technology for adding functionality to ceramics materials, as well as the selection of materials such as ceramics materials with high heat resistance and conductivity, and high-purity alumina and SiC that are highly pure and prevent contamination.


If you have trouble with the existing wafer Transfer End Effector / Handling Arm, please feel free to contact us.

Integrated response from processing to development of ceramic materials !

Please feel free to contact us !

TEL +81-26-248-1626

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Examples of VA/VE proposals
for designers and developers

  • Search by Problem
  • Search by Desired Effect
  • Search by Product Type
  • Deformation
  • Cost
  • Particles
  • Conductivity
  • Suction Marks
  • Static Electricity
  • Warped Wafer
  • Productivity (Throughput)
  • Impurities
  • Sparking
  • Wafer Scratching
  • Part Replacement Time
  • Outgassing
  • Surface Resistance
  • Wafer Sticking
  • Reflectance
  • Air-Permeability
  • Lint adhesion
  • Misalignment
  • Clogging
  • Plasma Resistance
  • Yield
  • Contact Damage
  • Product Life
  • Dust Emissions
  • Defect Rate
  • Heat Resistance
  • Contamination
  • Abrasion
  • Functionality
  • Chemical Resistance
  • Corrosion Resistance
  • 薄ウェハ

Part Replacement Time

薄ウェハ

  • 準備中です
  • Metal Contamination Control
  • Wear Resistance Improvement
  • Improved Functionality
  • Wafer Scratch Prevention
  • Anti-Static Measures
  • Improved Heat Resistance
  • Portability
  • Warped Wafer Prevention
  • Sparking Prevention
  • Improved Chemical Resistance
  • Improved Productivity
  • Misalignment Prevention
  • Reduced Defect Rate
  • Improved Productivity(Improved Throughput)
  • Wear Resistance
  • Contact Damage Reduction
  • Yield Improvement
  • Man-Hour Reduction
  • Surface Resistance Control
  • Wear Prevention
  • Particle Control
  • Suction Mark Reduction
  • Outgassing Reduction
  • Deformation Reduction
  • Improved Plasma Resistance
  • Long Service Life
  • Contamination Measures
  • Cost Reduction

Improved Functionality

Man-Hour Reduction

Cost Reduction

  • Wafer Transfer End Effector / Handling Arm
  • Baking Setter
  • Porous Chuck
  • Alumina Cover
  • PAD
  • Other

Wafer Transfer End Effector / Handling Arm

CONTACT

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