Example of VA / VE proposals

CERAMICS DESIGN LAB > Proposing PAD surface-treatment to prevent problems with wafer sticking

Proposing PAD surface-treatment to prevent problems with wafer sticking

  • Problems
    Wafer Scratching
    Wafer Sticking
    Contact Damage
  • Proposed Effect
    Wafer Scratch Prevention
    Misalignment Prevention
    Contact Damage Reduction
    Yield Improvement
  • Product Type
    Wafer Transfer End Effector / Handling ArmPAD

Customer's concerns and problems / Before

The use of fluoroplastic PAD has caused the wafer to stick to PAD.

In particular, when the surface roughness of PAD is rough, the wafers tend to stick to PAD, and when the wafers are released, they are misaligned and scratched.

Our proposals and improvement effects / After

The surface-treatment developed by ASUZAC for PAD was implemented to make it difficult for PAD to stick to the wafer.

This helped to prevent misalignment and scratches.

  • Proposing PAD surface-treatment to prevent problems with wafer sticking|Ceramics Design Lab
  • Proposing PAD surface-treatment to prevent problems with wafer sticking|Ceramics Design Lab

Point of the proposed example / Point

The point of this case is that the productivity was improved by changing the coating without changing the shape of the parts.

Asuzac focuses on material development and coating development, and it is possible to add new characteristics to parts without changing the base material or part shape.

Especially, this approach is effective for preventing static electricity and contamination.

The Fine Ceramics Division of ASUZAC Corporation, which operates the Ceramics Design Laboratory, handles everything from material development and preparation to design and manufacture, as well as surface treatment, inspection, and cleaning.

We can also offer our own coating-technology for adding functionality to ceramics materials, as well as the selection of materials such as ceramic materials with high heat resistance and conductivity, and high-purity alumina and SiC that are highly pure and prevent contamination.

If you have any trouble with the existing PAD, please do not hesitate to contact us.

Integrated response from processing to development of ceramic materials !

Please feel free to contact us !

TEL +81-26-248-1626

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Examples of VA/VE proposals
for designers and developers

  • Search by Problem
  • Search by Desired Effect
  • Search by Product Type
  • Deformation
  • Cost
  • Particles
  • Conductivity
  • Suction Marks
  • Static Electricity
  • Warped Wafer
  • Productivity (Throughput)
  • Impurities
  • Sparking
  • Wafer Scratching
  • Part Replacement Time
  • Outgassing
  • Surface Resistance
  • Wafer Sticking
  • Reflectance
  • Air-Permeability
  • Lint adhesion
  • Misalignment
  • Clogging
  • Plasma Resistance
  • Yield
  • Contact Damage
  • Product Life
  • Dust Emissions
  • Defect Rate
  • Heat Resistance
  • Contamination
  • Abrasion
  • Functionality
  • Chemical Resistance
  • Corrosion Resistance
  • 薄ウェハ

Part Replacement Time


  • 準備中です
  • Metal Contamination Control
  • Wear Resistance Improvement
  • Improved Functionality
  • Wafer Scratch Prevention
  • Anti-Static Measures
  • Improved Heat Resistance
  • Portability
  • Warped Wafer Prevention
  • Sparking Prevention
  • Improved Chemical Resistance
  • Improved Productivity
  • Misalignment Prevention
  • Reduced Defect Rate
  • Improved Productivity(Improved Throughput)
  • Wear Resistance
  • Contact Damage Reduction
  • Yield Improvement
  • Man-Hour Reduction
  • Surface Resistance Control
  • Wear Prevention
  • Particle Control
  • Suction Mark Reduction
  • Outgassing Reduction
  • Deformation Reduction
  • Improved Plasma Resistance
  • Long Service Life
  • Contamination Measures
  • Cost Reduction

Improved Functionality

Man-Hour Reduction

Cost Reduction

  • Wafer Transfer End Effector / Handling Arm
  • Baking Setter
  • Porous Chuck
  • Alumina Cover
  • PAD
  • Other

Wafer Transfer End Effector / Handling Arm


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