-
ProblemsContact Damage
Dust Emissions
Abrasion -
Proposed EffectContact Damage Reduction
Wear Prevention
Contamination Measures -
Product TypeWafer Transfer End Effector / Handling Arm
Customer's concerns and problems / Before
Our proposals and improvement effects / After
In response, the Ceramics Design Laboratory proposed a wafer transfer End Effector / Handling Arm for conductive ceramics (Corseed, our developed material) that has the same hardness as silicon.
This has greatly reduced the wear, scratches, damage, and dust generation of wafers due to contact damage, leading to a reduction in the defect rate.
In addition, since conductive ceramics is used, it is provided with conductivity just like metals, and conductive coating is not required.
Point of the proposed example / Point
The point of this case is that the material of the wafer Transfer End Effector / Handling Arm was replaced with a ceramics material having the same hardness as silicon from metal, thus reducing contact damage.
The Fine Ceramics Division of ASUZAC Corporation, which operates the Ceramics Design Laboratory, handles everything from material development and preparation to design and manufacture, as well as surface treatment, inspection, and cleaning.
We can also offer our own coating-technology for adding functionality to ceramics materials, as well as the selection of materials such as ceramics materials with high heat resistance and conductivity, and high-purity alumina and SiC that are highly pure and prevent contamination.
If you are considering changing the material from metal or resin products to ceramics, or if you are in trouble with the contact between the Transfer End Effector / Handling Arm and the wafer, please feel free to contact us.
Integrated response from processing to development of ceramic materials !
Please feel free to contact us !
Business hours: 9:00-17:00 (closed on Saturdays, Sundays and Holidays)
We have received a consultation from a customer of a semiconductor-inspection-equipment/transport-equipment manufacturer stating that “In CVD and etch process, a metal-based transport End Effector / Handling Arm is used to transport wafers, but there is a problem with damage and damage to silicon wafers caused by contact damage. Is there any good measure?”