Example of VA / VE proposals

CERAMICS DESIGN LAB > Reduction of contact damage by changing the material of the wafer Transfer End Effector / Handling Arm from metal to conductive ceramics

Reduction of contact damage by changing the material of the wafer Transfer End Effector / Handling Arm from metal to conductive ceramics

  • Problems
    Contact Damage
    Dust Emissions
    Abrasion
  • Proposed Effect
    Contact Damage Reduction
    Wear Prevention
    Contamination Measures
  • Product Type
    Wafer Transfer End Effector / Handling Arm

Customer's concerns and problems / Before

We have received a consultation from a customer of a semiconductor-inspection-equipment/transport-equipment manufacturer stating that “In CVD and etch process, a metal-based transport End Effector / Handling Arm is used to transport wafers, but there is a problem with damage and damage to silicon wafers caused by contact damage. Is there any good measure?”

Our proposals and improvement effects / After

In response, the Ceramics Design Laboratory proposed a wafer transfer End Effector / Handling Arm for conductive ceramics (Corseed, our developed material) that has the same hardness as silicon.


This has greatly reduced the wear, scratches, damage, and dust generation of wafers due to contact damage, leading to a reduction in the defect rate.


In addition, since conductive ceramics is used, it is provided with conductivity just like metals, and conductive coating is not required.

  • Reduction of contact damage by changing the material of the wafer Transfer End Effector / Handling Arm from metal to conductive ceramics|Ceramics Design Lab
  • Reduction of contact damage by changing the material of the wafer Transfer End Effector / Handling Arm from metal to conductive ceramics|Ceramics Design Lab
  • Reduction of contact damage by changing the material of the wafer Transfer End Effector / Handling Arm from metal to conductive ceramics|Ceramics Design Lab
  • Reduction of contact damage by changing the material of the wafer Transfer End Effector / Handling Arm from metal to conductive ceramics|Ceramics Design Lab

Point of the proposed example / Point

The point of this case is that the material of the wafer Transfer End Effector / Handling Arm was replaced with a ceramics material having the same hardness as silicon from metal, thus reducing contact damage.


The Fine Ceramics Division of ASUZAC Corporation, which operates the Ceramics Design Laboratory, handles everything from material development and preparation to design and manufacture, as well as surface treatment, inspection, and cleaning.


We can also offer our own coating-technology for adding functionality to ceramics materials, as well as the selection of materials such as ceramics materials with high heat resistance and conductivity, and high-purity alumina and SiC that are highly pure and prevent contamination.


If you are considering changing the material from metal or resin products to ceramics, or if you are in trouble with the contact between the Transfer End Effector / Handling Arm and the wafer, please feel free to contact us.

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Examples of VA/VE proposals
for designers and developers

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  • Deformation
  • Cost
  • Particles
  • Conductivity
  • Suction Marks
  • Static Electricity
  • 大型偏光フィルムの吸着
  • Warped Wafer
  • Productivity (Throughput)
  • Impurities
  • Sparking
  • Wafer Scratching
  • Part Replacement Time
  • Outgassing
  • Surface Resistance
  • Wafer Sticking
  • Reflectance
  • Air-Permeability
  • Lint adhesion
  • Misalignment
  • Clogging
  • Plasma Resistance
  • Yield
  • Contact Damage
  • Product Life
  • Dust Emissions
  • Defect Rate
  • Heat Resistance
  • Contamination
  • Abrasion
  • Functionality
  • Chemical Resistance
  • Corrosion Resistance
  • 薄ウェハ

Part Replacement Time

薄ウェハ

  • 準備中です
  • Metal Contamination Control
  • Wear Resistance Improvement
  • Improved Functionality
  • Wafer Scratch Prevention
  • Anti-Static Measures
  • Improved Heat Resistance
  • Portability
  • Warped Wafer Prevention
  • Sparking Prevention
  • Improved Chemical Resistance
  • Improved Productivity
  • Misalignment Prevention
  • Reduced Defect Rate
  • Improved Productivity(Improved Throughput)
  • Wear Resistance
  • Contact Damage Reduction
  • Yield Improvement
  • Man-Hour Reduction
  • Surface Resistance Control
  • Wear Prevention
  • Particle Control
  • Suction Mark Reduction
  • Outgassing Reduction
  • Deformation Reduction
  • Improved Plasma Resistance
  • Long Service Life
  • ワークの傷防止
  • Contamination Measures
  • Cost Reduction

Improved Functionality

Improved Productivity(Improved Throughput)

Man-Hour Reduction

Cost Reduction

  • Wafer Transfer End Effector / Handling Arm
  • Baking Setter
  • Porous Chuck
  • Alumina Cover
  • PAD
  • Other

Wafer Transfer End Effector / Handling Arm

CONTACT

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