Example of VA / VE proposals

CERAMICS DESIGN LAB > Cost reduction by remodeling the wafer Transfer End Effector / Handling Arm -holding section to a PAD

Cost reduction by remodeling the wafer Transfer End Effector / Handling Arm -holding section to a PAD

  • Problems
    Abrasion
    Static Electricity
    Part Replacement Time
    Cost
  • Proposed Effect
    Man-Hour Reduction
    Cost Reduction
    Improved Functionality
    Improved Productivity
    Wear Resistance
  • Product Type
    Wafer Transfer End Effector / Handling ArmPAD

Customer's concerns and problems / Before

A customer of a semiconductor device manufacturer asked, “When the wafer holding part of a robot End Effector / Handling Arm for etching equipment deteriorates and wears out, the entire End Effector / Handling Arm has to be replaced, which is very expensive.” The customer asked us, “Can you do something about it?”

Our proposals and improvement effects / After

In response, the Ceramics Design Laboratory proposed changing the specifications of the three-point wafer holding section (convex) from a one-piece processing to a removable PAD.


As a consequence, there is no need to replace the transfer hands themselves, and only the worn PAD needs to be replaced, resulting in a significant cost reduction.


At the same time, we proposed a Black Alumina-coated transport End Effector / Handling Arm with high wear resistance and high static electricity diffusion properties, which also contributed to extending the life of our products.

  • Cost reduction by remodeling the wafer Transfer End Effector / Handling Arm -holding section to a PAD|Ceramics Design Lab
  • Cost reduction by remodeling the wafer Transfer End Effector / Handling Arm -holding section to a PAD|Ceramics Design Lab
  • Cost reduction by remodeling the wafer Transfer End Effector / Handling Arm -holding section to a PAD|Ceramics Design Lab
  • Cost reduction by remodeling the wafer Transfer End Effector / Handling Arm -holding section to a PAD|Ceramics Design Lab

Point of the proposed example / Point

The point of this case is that the replacement cost is drastically reduced by replacing the holding part with a removable PAD even if the Transfer End Effector / Handling Arm themselves do not need to be replaced.


Though the initial cost is a little higher than the integrated machining, the cost is lower when the running cost is considered by PAD.


The Fine Ceramics Division of ASUZAC Corporation, which operates the Ceramics Design Laboratory, handles everything from material development and preparation to design and manufacture, as well as surface treatment, inspection, and cleaning.


We can also offer our own coating-technology for adding functionality to ceramics materials, as well as the selection of materials such as ceramics materials with high heat resistance and conductivity, and high-purity alumina and SiC that are highly pure and prevent contamination.


If you are not sure of the shape design and cost reduction of the wafer Transfer End Effector / Handling Arm, please feel free to contact us.

Integrated response from processing to development of ceramic materials !

Please feel free to contact us !

TEL +81-26-248-1626

Business hours: 9:00-17:00 (closed on Saturdays, Sundays and Holidays)

Examples of VA/VE proposals
for designers and developers

  • Search by Problem
  • Search by Desired Effect
  • Search by Product Type
  • Deformation
  • Cost
  • Particles
  • Conductivity
  • Suction Marks
  • Static Electricity
  • 大型偏光フィルムの吸着
  • Warped Wafer
  • Productivity (Throughput)
  • Impurities
  • Sparking
  • Wafer Scratching
  • Part Replacement Time
  • Outgassing
  • Surface Resistance
  • Wafer Sticking
  • Reflectance
  • Air-Permeability
  • Lint adhesion
  • Misalignment
  • Clogging
  • Plasma Resistance
  • Yield
  • Contact Damage
  • Product Life
  • Dust Emissions
  • Defect Rate
  • Heat Resistance
  • Contamination
  • Abrasion
  • Functionality
  • Chemical Resistance
  • Corrosion Resistance
  • 薄ウェハ

Part Replacement Time

薄ウェハ

  • 準備中です
  • Metal Contamination Control
  • Wear Resistance Improvement
  • Improved Functionality
  • Wafer Scratch Prevention
  • Anti-Static Measures
  • Improved Heat Resistance
  • Portability
  • Warped Wafer Prevention
  • Sparking Prevention
  • Improved Chemical Resistance
  • Improved Productivity
  • Misalignment Prevention
  • Reduced Defect Rate
  • Improved Productivity(Improved Throughput)
  • Wear Resistance
  • Contact Damage Reduction
  • Yield Improvement
  • Man-Hour Reduction
  • Surface Resistance Control
  • Wear Prevention
  • Particle Control
  • Suction Mark Reduction
  • Outgassing Reduction
  • Deformation Reduction
  • Improved Plasma Resistance
  • Long Service Life
  • ワークの傷防止
  • Contamination Measures
  • Cost Reduction

Improved Functionality

Improved Productivity(Improved Throughput)

Man-Hour Reduction

Cost Reduction

  • Wafer Transfer End Effector / Handling Arm
  • Baking Setter
  • Porous Chuck
  • Alumina Cover
  • PAD
  • Other

Wafer Transfer End Effector / Handling Arm

CONTACT

The quotation and inquiries are available by the telephone /FAX or the mail .