Example of VA / VE proposals

CERAMICS DESIGN LAB > Proposal of a End Effector / Handling Arm with PAD that can adsorb and transport warped wafers

Proposal of a End Effector / Handling Arm with PAD that can adsorb and transport warped wafers

  • Problems
    Warped Wafer
  • Proposed Effect
    Warped Wafer Prevention
    Improved Productivity(Improved Throughput)
  • Product Type
    Wafer Transfer End Effector / Handling ArmPAD

Customer's concerns and problems / Before

When transferring warped wafers, we consulted with us that the normal suction End Effector / Handling Arm has not been able to transfer them.


Since errors occur frequently during the transfer of warped wafers, they said that this has led to a decrease in productivity.

Our proposals and improvement effects / After

We have proposed a PAD suction hand from Asuzac,and it is now possible to transfer warped wafers without any trouble.


We were able to contribute to stable facility operation without errors during transportation.

  • Proposal of a End Effector / Handling Arm  with PAD that can adsorb and transport warped wafers|Ceramics Design Lab
  • Proposal of a End Effector / Handling Arm  with PAD that can adsorb and transport warped wafers|Ceramics Design Lab
  • Proposal of a End Effector / Handling Arm  with PAD that can adsorb and transport warped wafers|Ceramics Design Lab

Point of the proposed example / Point

The point of this case is the minimization of the negative effect by warped wafer.


Warp wafers are generally difficult to transport, and it is necessary to stop equipment and replace End Effector / Handling Arm. However, even if the wafers warp, the use of a End Effector / Handling Arm that can transport wafers makes it possible to fundamentally prevent warp wafers.


The Fine Ceramics Division of ASUZAC Corporation, which operates the Ceramics Design Laboratory, handles everything from material development and preparation to design and manufacture, as well as surface treatment, inspection, and cleaning.


We can also offer our own coating-technology for adding functionality to ceramics materials, as well as the selection of materials such as ceramics materials with high heat resistance and conductivity, and high-purity alumina and SiC that are highly pure and prevent contamination.


If you have any questions about warped wafers, please feel free to contact us.

Integrated response from processing to development of ceramic materials !

Please feel free to contact us !

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Examples of VA/VE proposals
for designers and developers

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  • Deformation
  • Cost
  • Particles
  • Conductivity
  • Suction Marks
  • Static Electricity
  • 大型偏光フィルムの吸着
  • Warped Wafer
  • Productivity (Throughput)
  • Impurities
  • Sparking
  • Wafer Scratching
  • Part Replacement Time
  • Outgassing
  • Surface Resistance
  • Wafer Sticking
  • Reflectance
  • Air-Permeability
  • Lint adhesion
  • Misalignment
  • Clogging
  • Plasma Resistance
  • Yield
  • Contact Damage
  • Product Life
  • Dust Emissions
  • Defect Rate
  • Heat Resistance
  • Contamination
  • Abrasion
  • Functionality
  • Chemical Resistance
  • Corrosion Resistance
  • 薄ウェハ

Part Replacement Time

薄ウェハ

  • 準備中です
  • Metal Contamination Control
  • Wear Resistance Improvement
  • Improved Functionality
  • Wafer Scratch Prevention
  • Anti-Static Measures
  • Improved Heat Resistance
  • Portability
  • Warped Wafer Prevention
  • Sparking Prevention
  • Improved Chemical Resistance
  • Improved Productivity
  • Misalignment Prevention
  • Reduced Defect Rate
  • Improved Productivity(Improved Throughput)
  • Wear Resistance
  • Contact Damage Reduction
  • Yield Improvement
  • Man-Hour Reduction
  • Surface Resistance Control
  • Wear Prevention
  • Particle Control
  • Suction Mark Reduction
  • Outgassing Reduction
  • Deformation Reduction
  • Improved Plasma Resistance
  • Long Service Life
  • ワークの傷防止
  • Contamination Measures
  • Cost Reduction

Improved Functionality

Improved Productivity(Improved Throughput)

Man-Hour Reduction

Cost Reduction

  • Wafer Transfer End Effector / Handling Arm
  • Baking Setter
  • Porous Chuck
  • Alumina Cover
  • PAD
  • Other

Wafer Transfer End Effector / Handling Arm

CONTACT

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