Over the past years, we have accumulated all the questions from our
customers and summarized them.Please search from the category menu below or the search window.


Over the past years, we have accumulated all the questions from our
customers and summarized them. Please click the Category menu on the left or the Search box bellow.

  • Wafer Transfer End Effector / Handling Arm

    • It is possible to rent our original the End Effector / Handling Arm demonstration machine.
      Ejectors for suction End Effector / Handling Arm are available.
      The equipment can be used immediately as long as compressed air is available.
      If you need a wrist block or other parts for installation of the device, we can make them for you.
      We have a lineup available for loan, so please contact us for details.

      >>Click here for inquiries about demo machine rental.

    • Yes, it is possible.
      Usually, sensors are installed in the groove.
      As a special example, a sensor that crawls on the side of the Transfer End Effector / Handling Arm or a type that passes the sensor inside the cavity is available.
      Please feel free to contact us if you have any requests such as wishing to attach a sensor or arranging a Transfer End Effector / Handling Arm with a sensor.

  • Porous Chuck

  • Ceramics products

    • As dummy wafers, we have a proven track record in manufacturing with alumina and alumina (our original material). Alcema has a 2.41g/cm specific gravity of ^3, which is close to the specific gravity of silicon wafers, making them easy to handle. Each can be manufactured on an inch-by-inch basis to suit your use, and the required dimensions such as 0.3mm and 0.7mm are available.

    • We will propose wave and V-shaped setters.
      The V-shaped setter can be manufactured with external 140 mm×100 mm, thickness 8 mm, V-shaped angle 112.6°, and pitch 120 mm(P12×10. The reaction between the setter and the work piece can be minimized by placing the work piece on the wave-shaped or V-shaped setter and firing.

    • With a Porous Chuck, it is difficult to adsorb paper or Japanese paper.
      A material with an uneven surface leaks from there, making it difficult to adsorb.
      For example, it may be possible to press a work piece against the Porous Chuck while air is being sucked, or to suck depending on the thickness and surface condition of the suctioning target, so please try a demonstration machine.

      >>Apply for the Porous Chuck demo here.

    • Depending on the thickness of the wafer and the amount of warpage, our Bernoulli End Effector / Handling Arm and Porous End Effector / Handling Arm are available as measures against warped wafers.
      Wafers can be checked and tested for transport at our Robot Test Center. Please contact us if you have any problems.

      >>Here is an example of VA / VE suggestions

    • Yes, it is possible.
      As an example of improvement, some customers attach metal arms to their hands and use them to transport and unload wafers.

  • Ceramics material

    • A measure of how much space is contained, such as intergranular voids.
      Defined as the ratio of the volume of space to the total volume of material.
      For details, see the link below.
      Since there are various kinds of porous ceramics such as porosity, we will propose suitable ones according to the environment of use of our customers.
      Please contact us for more information.

      >>Click here for consultation and inquiry

    • Low thermal conductivity Alsima L (original material) is available.
      Compared to ordinary alumina ceramics, it is resistant to thermal shock and has low thermal expansion and low thermal conductivity.
      It can be used for applications such as heat insulation and prevention of heat diffusion around the heat source.
      The sample can be lent out, so please feel free to contact us.

    • For alumina, the length 4000 mm, breadth 70 mm, and thickness 50 mm are guidelines.
      For SiC, 500 mm×500 mm×5 mm is a rough guide.
      For other materials, 300 mm×300 mm×10 mm is a rough guide.
      Even within the above size, it may not be possible to manufacture depending on the product shape. Contact CKD for more information.

      >>This is the product size that can be used.

    • We have a solid track record in the front-end and back-end processes for semiconductor production equipment and liquid crystal manufacturing equipment.
      Transfer hands are especially widely used.
      In addition, we have a proven track record in small parts such as pins, as well as large 4m size parts.
      For details, please refer to the product category.

      >>Click here for examples of our custom-made products.

    • Alumina is about 1000°C and silicon carbide is about 2000°C. As it varies slightly depending on the purity and grade, please contact us for details.

    • For shapes with a proven track record, outer dimension 245 mm×135 mm, inner dimension 225 mm×115 mm, height 50 mm, and depth 40 mm can be manufactured.
      When fitting is required, circular Nigei shape of Φ5 can be manufactured on the bottom surface. Please contact us for other sizes.

    • Among ceramics, porous ceramics have high degreasing properties.
      In particular, materials with large pore diameters, such as AZPW40 and AZPV60, and structurally highly breathable materials are highly degreasable.
      The use of a highly degreasing setter has improved the cracking and chipping of the product.

    • Yes, it is possible.
      AZPS40 is used in soil-related studies.
      Materials with high air permeability are easy to pass through with water.
      The samples are available for loan, so please try them out.

      >>Apply for the porous chuck demo here.

    • The reflectance will be 5.1 to 15.3 % in the wave 240~2600 nm.
      Black alumina can suppress surface reflection while maintaining strength and durability.
      Black alumina is used in applications that require low reflection, such as microscopes and inspection equipment.

  • Processing and technology

    • We are able to process 0.05 mm in terms of parallelism for alumina-based materials of Φ200mm x thickness 2 mm. As it varies depending on the size, thickness and material, please contact us for details.

      >>Click here for consultation and inquiry

    • The thinnest 1 mm is available, depending on the material and configuration.

    • We can do this for our materials.
      We can also handle surface treatment such as coating and blasting from the general details such as additional drilling of holes and counter bores.
      If you consult with us about problems and problems with the products you are currently using, we can propose them regardless of whether they are newly manufactured or additionally manufactured.

    • Our original technology for creating cavities inside in one piece.
      Normally, the flow path for adsorption is manufactured by the lamination method. Cavity generation is possible without lamination in the cavity integral.
      There is no risk of leakage due to the lack of adhesive.
      It is also effective for use at high temperatures, as well as for measures against outgassing and dust adhesion.
      Longer life compared to laminating.
      Please see the following pages for details.

      >>Details of cavity molding techniques are given here.

    • Possible.
      We apply screw processing directly to the ceramics, and also apply heli-insert tangles.
      In addition, we also provide adhesive support for metal bushes, so we will respond to the customer’s application.
      Torque tests are also conducted on the screws after processing and assembly. Coarse and fine threads can also be handled.
      Please contact us for more information.

    • For the corners that are most likely to be chipped, we recommend C-face or R-chamfering.
      We also perform C-chamfering (about 0.2 to 0.3) and R-chamfering.
      In addition, the C chamfer C1 is recommended for the mouth of the hole to prevent chipping and cracking at the mouth.
      In addition, depending on the material and shape, there may be cracks caused by thermal shock, so expert staff can propose materials and propose them according to the product.
      Please contact us for more information.

    • Grooving is possible.
      However, because it is difficult to groove the pin angle, it becomes R-shaped.
      Basically, it can be processed in the same way as dense ceramics, but porous ceramics are brittle, so some are difficult depending on the product size and processing content.
      If there is anything you would like to make, please contact us for more information.

    • Yes, it is possible. F/f/H/h standards are available. In addition to through holes and track shapes, deep counter bore shapes are also available. Depending on the height (depth), there may be cases where the effective depth occurs with the hole. F and H standards are available for holes. Positioning can also be used by customers with problems.

    • Although it depends on the shape and material, we have a proven track record in processing thinness of 0.3 mm using our surface grinders. Care must be taken when thinning because it tends to crack or warp due to residual stress.

    • The surface roughness depends on the material and processing method.
      For example, when machining with a surface grinder, alumina is about Ra1.6 and silicon carbide is about Ra0.4.
      Fine ceramics are basically machined using diamond tools, but they vary depending on the state of the tool and the machining conditions, making it difficult to control the surface roughness.
      If you want to roughen the surface, there are some methods such as changing the machining tools and conditions or blasting.
      If you want to polish the surface, you can use buffing or lapping.

    • We have two types of bonding, one using adhesive and the other diffusion bonding.
      There are organic and inorganic adhesives, each of which can be proposed according to the user’s environment.
      Diffusion bonding is available only for the specific material (silicon carbide) at present, and may not be available depending on the shape.

  • Other

    • We are sorry, but we do not handle the sale of raw materials.

    • The first transaction must be paid in advance or COD (cash on delivery); for the second and subsequent transactions, please contact us.

    • Please contact us for details.

    • We do not deal in the molding process, which is based on raw materials.

    • Quotation request → Drawing confirmation → Study by us → Issue estimate → Order → Payment (prepaid) → Product production → Shipment → Delivery.
      If you do not have a drawing, you can also propose it.
      Please contact us for details.

    • Depending on the desired shape and the operating conditions of the factory, we will deliver the product within a minimum of three weeks to one month. Please contact us for details.

    • Since there is a wafer transfer robot, a transfer test is possible.
      As examples, vibration confirmation during transportation, measurement of positional deviation (repetition accuracy) of the wafer according to the number of transportation, confirmation of scratches on the back surface of the wafer, etc.
      It is also possible to take additional measures in the discussion with the customer.
      Please contact us for more information.

    • Yes, it is possible.
      Our specialist will handle it.
      We will listen to the operating environment and propose materials, shapes, etc. that can be manufactured by us.
      Please feel free to contact us first.

    • Weight analysis is possible.
      Set the boundary conditions, physical properties, and analysis conditions on 3D CAD screen. Then, perform the analysis.
      The stress distribution and displacement distribution can be analyzed to simulate the stress and deformation applied to arbitrarily shaped parts.
      For example, if you want to transport a 1kg plate, you can simulate it by analyzing how much stress is applied to your hands. We can propose optimal materials and shapes depending on the work piece to be transported. Please contact us for details.

    • Yes, it is possible.
      Our specialist will handle it.
      We will listen to the operating environment and propose materials, shapes, etc. that can be manufactured by us. Please feel free to contact us first.

    • Yes, it is possible. For process and equipment troubleshooting, as well as for handling next-generation parts and hand prototypes, even one product can be used, so please contact us once.

    • Our ceramics products are basically cleaned by combining alkaline cleaning, acid cleaning and pure water cleaning.
      Depending on the quality requirements, we also perform more precise cleaning than usual.
      For instance, special precision acid cleaning is applied to the metal contamination, and the value is less than the dissolution 3ppb depending on the material.


The quotation and inquiries are available by the telephone /FAX or the mail .