Example of VA / VE proposals

CERAMICS DESIGN LAB > Proposal of a wafer Transfer End Effector / Handling Arm with superior electrostatic diffusion effect even at high temperatures

Proposal of a wafer Transfer End Effector / Handling Arm with superior electrostatic diffusion effect even at high temperatures

  • Problems
    Heat Resistance
    Static Electricity
    Surface Resistance
  • Proposed Effect
    Improved Functionality
    Anti-Static Measures
    Surface Resistance Control
  • Product Type
    Wafer Transfer End Effector / Handling Arm

Customer's concerns and problems / Before

From a customer of a semiconductor manufacturing equipment manufacturer, we consulted with us, who has an extensive experience in manufacturing wafer Transfer End Effector / Handling Arm, stating, “Is it possible to manufacture a wafer transfer Transfer End Effector / Handling Arm that can withstand 500°C to 800°C operating environment and has a sufficient electrostatic diffusion effect?”

Our proposals and improvement effects / After

Therefore, the Ceramics Design Laboratory proposed a wafer Transfer End Effector / Handling Arm with our original coated “ADC film” that has a low surface-resistance even at high temperatures and is highly effective in diffusing static electricity.


As a result of actual use by customers, they said that they could be used in high-temperature environments at 500 ℃ to 750 ℃ without any problems.

  • Proposal of a wafer Transfer End Effector / Handling Arm with superior electrostatic diffusion effect even at high temperatures|Ceramics Design Lab
  • Proposal of a wafer Transfer End Effector / Handling Arm with superior electrostatic diffusion effect even at high temperatures|Ceramics Design Lab
  • Proposal of a wafer Transfer End Effector / Handling Arm with superior electrostatic diffusion effect even at high temperatures|Ceramics Design Lab

Point of the proposed example / Point

The point of this case is that a special coating realizes a wafer Transfer End Effector / Handling Arm with a low surface resistance value and high electrostatic diffusion effect even under high temperature.


Electrostatic diffusivity is very important in preventing lint from adhering to the surface of the wafer when it is wiped off with a waste cloth or in taking measures against particles.


Our proprietary coating-technology ADC film maintains a low-surface-resistance even in high-temperature environments, ensuring sufficient electrostatic diffusivity.


The Fine Ceramics Division of ASUZAC Corporation, which operates the Ceramics Design Laboratory, handles everything from material development and preparation to design and manufacture, as well as surface treatment, inspection, and cleaning.


We can also offer our own coating-technology for adding functionality to ceramics materials, as well as the selection of materials such as ceramics materials with high heat resistance and conductivity, and high-purity alumina and SiC that are highly pure and prevent contamination.


If you are troubled by defects caused by lint or impurities, please feel free to contact us.

Integrated response from processing to development of ceramic materials !

Please feel free to contact us !

TEL +81-26-248-1626

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Examples of VA/VE proposals
for designers and developers

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  • Deformation
  • Cost
  • Particles
  • Conductivity
  • Suction Marks
  • Static Electricity
  • Warped Wafer
  • Productivity (Throughput)
  • Impurities
  • Sparking
  • Wafer Scratching
  • Part Replacement Time
  • Outgassing
  • Surface Resistance
  • Wafer Sticking
  • Reflectance
  • Air-Permeability
  • Lint adhesion
  • Misalignment
  • Clogging
  • Plasma Resistance
  • Yield
  • Contact Damage
  • Product Life
  • Dust Emissions
  • Defect Rate
  • Heat Resistance
  • Contamination
  • Abrasion
  • Functionality
  • Chemical Resistance
  • Corrosion Resistance
  • 薄ウェハ

Part Replacement Time

薄ウェハ

  • 準備中です
  • Metal Contamination Control
  • Wear Resistance Improvement
  • Improved Functionality
  • Wafer Scratch Prevention
  • Anti-Static Measures
  • Improved Heat Resistance
  • Portability
  • Warped Wafer Prevention
  • Sparking Prevention
  • Improved Chemical Resistance
  • Improved Productivity
  • Misalignment Prevention
  • Reduced Defect Rate
  • Improved Productivity(Improved Throughput)
  • Wear Resistance
  • Contact Damage Reduction
  • Yield Improvement
  • Man-Hour Reduction
  • Surface Resistance Control
  • Wear Prevention
  • Particle Control
  • Suction Mark Reduction
  • Outgassing Reduction
  • Deformation Reduction
  • Improved Plasma Resistance
  • Long Service Life
  • Contamination Measures
  • Cost Reduction

Improved Functionality

Man-Hour Reduction

Cost Reduction

  • Wafer Transfer End Effector / Handling Arm
  • Baking Setter
  • Porous Chuck
  • Alumina Cover
  • PAD
  • Other

Wafer Transfer End Effector / Handling Arm

CONTACT

The quotation and inquiries are available by the telephone /FAX or the mail .