Example of VA / VE proposals

CERAMICS DESIGN LAB > Proposal for a transport End Effector / Handling Arm that can suck warped wafers

Proposal for a transport End Effector / Handling Arm that can suck warped wafers

  • Problems
    Warped Wafer
    Wafer Scratching
    Misalignment
  • Proposed Effect
    Warped Wafer Prevention
    Misalignment Prevention
    Improved Functionality
    Yield Improvement
  • Product Type
    Wafer Transfer End Effector / Handling Arm

Customer's concerns and problems / Before

A customer of a semiconductor manufacturing equipment manufacturer asked us, “Wafers sometimes warp during the manufacturing process. Is it possible to manufacture a Transfer End Effector / Handling Arm that can pick up warped wafers?”


We have a wealth of experience in manufacturing wafer Transfer End Effector / Handling Arm.

Our proposals and improvement effects / After

Therefore, the Ceramics Design Laboratory proposed a Transfer End Effector / Handling Arm with six suction holes on the circumference along the wafer periphery so that 6-inch warped wafers can be stably sucked.


Design and manufacture were conducted in-house, and when they were evaluated by the customer, they said that they could be used without any problems.

  • Proposal for a transport End Effector / Handling Arm that can suck warped wafers|Ceramics Design Lab
  • Proposal for a transport End Effector / Handling Arm that can suck warped wafers|Ceramics Design Lab

Point of the proposed example / Point

The point of this case is to devise the transfer hand design so that the warped wafer can be held stably.


Warping of wafers is caused by stresses generated in various manufacturing processes including polishing, but it causes wafers to fall due to insufficient suction or vacuum leakage.


When designing a transport End Effector / Handling Arm for warped wafers, it is necessary to consider these points when designing the hand.


The Fine Ceramics Division of ASUZAC Corporation, which operates the Ceramics Design Laboratory, handles everything from material development and preparation to design and manufacture, as well as surface treatment, inspection, and cleaning.


We can also offer our own coating-technology for adding functionality to ceramics materials, as well as the selection of materials such as ceramics materials with high heat resistance and conductivity, and high-purity alumina and SiC that are highly pure and prevent contamination.


If you have any questions about transporting warped wafers, please feel free to contact us.

Integrated response from processing to development of ceramic materials !

Please feel free to contact us !

TEL +81-26-248-1626

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Examples of VA/VE proposals
for designers and developers

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  • Deformation
  • Cost
  • Particles
  • Conductivity
  • Suction Marks
  • Static Electricity
  • Warped Wafer
  • Productivity (Throughput)
  • Impurities
  • Sparking
  • Wafer Scratching
  • Part Replacement Time
  • Outgassing
  • Surface Resistance
  • Wafer Sticking
  • Reflectance
  • Air-Permeability
  • Lint adhesion
  • Misalignment
  • Clogging
  • Plasma Resistance
  • Yield
  • Contact Damage
  • Product Life
  • Dust Emissions
  • Defect Rate
  • Heat Resistance
  • Contamination
  • Abrasion
  • Functionality
  • Chemical Resistance
  • Corrosion Resistance
  • 薄ウェハ

Part Replacement Time

薄ウェハ

  • 準備中です
  • Metal Contamination Control
  • Wear Resistance Improvement
  • Improved Functionality
  • Wafer Scratch Prevention
  • Anti-Static Measures
  • Improved Heat Resistance
  • Portability
  • Warped Wafer Prevention
  • Sparking Prevention
  • Improved Chemical Resistance
  • Improved Productivity
  • Misalignment Prevention
  • Reduced Defect Rate
  • Improved Productivity(Improved Throughput)
  • Wear Resistance
  • Contact Damage Reduction
  • Yield Improvement
  • Man-Hour Reduction
  • Surface Resistance Control
  • Wear Prevention
  • Particle Control
  • Suction Mark Reduction
  • Outgassing Reduction
  • Deformation Reduction
  • Improved Plasma Resistance
  • Long Service Life
  • Contamination Measures
  • Cost Reduction

Improved Functionality

Man-Hour Reduction

Cost Reduction

  • Wafer Transfer End Effector / Handling Arm
  • Baking Setter
  • Porous Chuck
  • Alumina Cover
  • PAD
  • Other

Wafer Transfer End Effector / Handling Arm

CONTACT

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