Example of VA / VE proposals

CERAMICS DESIGN LAB > Material change to Black Alumina pin

Material change to Black Alumina pin

  • Problems
    Plasma Resistance
    Heat Resistance
    Reflectance
  • Proposed Effect
    Wear Resistance Improvement
    Improved Heat Resistance
    Improved Plasma Resistance
  • Product Type
    Other

Customer's concerns and problems / Before

Consult with us about the black pin parts used to align the wafer when it is placed on the quartz plate.


In a high-temperature environment and at 750 ℃, the current parts are consuming a lot of time, so we looked for highly durable ceramic parts.

Our proposals and improvement effects / After

We proposed the manufacture of parts using Black Alumina, which has high heat resistance.


Black Alumina is a material used when low reflectance is required in parts for light sources, microscopes, and inspection equipment.


It has a longer life (higher plasma resistance) and better color retention than quartz.


It was manufactured as a ceramics part that does not color and wear even in high-temperature environments, resulting in a cost reduction.

  • Material change to Black Alumina pin|Ceramics Design Lab
  • Material change to Black Alumina pin|Ceramics Design Lab
  • Material change to Black Alumina pin|Ceramics Design Lab
  • Material change to Black Alumina pin|Ceramics Design Lab

Point of the proposed example / Point

The point of this case is the selection of the most suitable material for the usage environment.


Unlike metal materials, which are widely known for specifications and characteristics, ceramics materials have different characteristics for each manufacturer.


In extreme terms, it is also possible for users to mix materials on a part-by-part basis, so improvements can be made from materials according to the required performance.


The Fine Ceramics Division of ASUZAC Corporation, which operates the Ceramics Design Laboratory, handles everything from material development and preparation to design and manufacture, as well as surface treatment, inspection, and cleaning.


We can also offer our own coating-technology for adding functionality to ceramics materials, as well as the selection of materials such as ceramics materials with high heat resistance and conductivity, and high-purity alumina and SiC that are highly pure and prevent contamination.


If you have any questions about ceramic components, please feel free to contact us.

Integrated response from processing to development of ceramic materials !

Please feel free to contact us !

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Examples of VA/VE proposals
for designers and developers

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  • Deformation
  • Cost
  • Particles
  • Conductivity
  • Suction Marks
  • Static Electricity
  • 大型偏光フィルムの吸着
  • Warped Wafer
  • Productivity (Throughput)
  • Impurities
  • Sparking
  • Wafer Scratching
  • Part Replacement Time
  • Outgassing
  • Surface Resistance
  • Wafer Sticking
  • Reflectance
  • Air-Permeability
  • Lint adhesion
  • Misalignment
  • Clogging
  • Plasma Resistance
  • Yield
  • Contact Damage
  • Product Life
  • Dust Emissions
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  • Heat Resistance
  • Contamination
  • Abrasion
  • Functionality
  • Chemical Resistance
  • Corrosion Resistance
  • 薄ウェハ

Part Replacement Time

薄ウェハ

  • 準備中です
  • Metal Contamination Control
  • Wear Resistance Improvement
  • Improved Functionality
  • Wafer Scratch Prevention
  • Anti-Static Measures
  • Improved Heat Resistance
  • Portability
  • Warped Wafer Prevention
  • Sparking Prevention
  • Improved Chemical Resistance
  • Improved Productivity
  • Misalignment Prevention
  • Reduced Defect Rate
  • Improved Productivity(Improved Throughput)
  • Wear Resistance
  • Contact Damage Reduction
  • Yield Improvement
  • Man-Hour Reduction
  • Surface Resistance Control
  • Wear Prevention
  • Particle Control
  • Suction Mark Reduction
  • Outgassing Reduction
  • Deformation Reduction
  • Improved Plasma Resistance
  • Long Service Life
  • ワークの傷防止
  • Contamination Measures
  • Cost Reduction

Improved Functionality

Improved Productivity(Improved Throughput)

Man-Hour Reduction

Cost Reduction

  • Wafer Transfer End Effector / Handling Arm
  • Baking Setter
  • Porous Chuck
  • Alumina Cover
  • PAD
  • Other

Wafer Transfer End Effector / Handling Arm

CONTACT

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