Example of VA / VE proposals

CERAMICS DESIGN LAB > Reduction of defect rate of electrostatic diffusion End Effector / Handling Arm by changing coating

Reduction of defect rate of electrostatic diffusion End Effector / Handling Arm by changing coating

  • Problems
    Impurities
    Static Electricity
    Sparking
    Lint adhesion
  • Proposed Effect
    Contamination Measures
    Anti-Static Measures
    Sparking Prevention
    Reduced Defect Rate
  • Product Type
    Wafer Transfer End Effector / Handling Arm

Customer's concerns and problems / Before

When cleaning wafer Transfer End Effector / Handling Arm at the customer’s side, lint from the rag adhered to the surface, causing a drop in yield.

Our proposals and improvement effects / After

In response, the Ceramics Design Laboratory proposed replacing with a wafer Transfer End Effector / Handling Arm that adds conductivity to alumina using our proprietary coating technology.


As a result, it led to countermeasures against static electricity and improved surface roughness, which made it difficult for impurities such as lint to adhere, thereby reducing the defect rate.

  • Reduction of defect rate of electrostatic diffusion End Effector / Handling Arm by changing coating|Ceramics Design Lab
  • Reduction of defect rate of electrostatic diffusion End Effector / Handling Arm by changing coating|Ceramics Design Lab
  • Reduction of defect rate of electrostatic diffusion End Effector / Handling Arm by changing coating|Ceramics Design Lab
  • Reduction of defect rate of electrostatic diffusion End Effector / Handling Arm by changing coating|Ceramics Design Lab

Point of the proposed example / Point

The point of this case is that the amount of impurities deposited has been greatly reduced by countermeasures against static electricity.


Sparks caused by static electricity lead to the adhesion of impurities, resulting in problems such as scratches and warping of the wafer.


Countermeasures against this problem include the application of a conductive coating, as well as the use of a conductive ceramics material that is conductive itself and does not require a coating.


The Fine Ceramics Division of ASUZAC Corporation, which operates the Ceramics Design Laboratory, handles everything from material development and preparation to design and manufacture, as well as surface treatment, inspection, and cleaning.


We can also offer our own coating-technology for adding functionality to ceramics materials, as well as the selection of materials such as ceramics materials with high heat resistance and conductivity, and high-purity Alumina and SiC that are highly pure and prevent contamination.


If you have trouble with the existing wafer Transfer End Effector / Handling Arm, please feel free to contact us.

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Please feel free to contact us !

TEL +81-26-248-1626

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Examples of VA/VE proposals
for designers and developers

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  • Deformation
  • Cost
  • Particles
  • Conductivity
  • Suction Marks
  • Static Electricity
  • 大型偏光フィルムの吸着
  • Warped Wafer
  • Productivity (Throughput)
  • Impurities
  • Sparking
  • Wafer Scratching
  • Part Replacement Time
  • Outgassing
  • Surface Resistance
  • Wafer Sticking
  • Reflectance
  • Air-Permeability
  • Lint adhesion
  • Misalignment
  • Clogging
  • Plasma Resistance
  • Yield
  • Contact Damage
  • Product Life
  • Dust Emissions
  • Defect Rate
  • Heat Resistance
  • Contamination
  • Abrasion
  • Functionality
  • Chemical Resistance
  • Corrosion Resistance
  • 薄ウェハ

Part Replacement Time

薄ウェハ

  • 準備中です
  • Metal Contamination Control
  • Wear Resistance Improvement
  • Improved Functionality
  • Wafer Scratch Prevention
  • Anti-Static Measures
  • Improved Heat Resistance
  • Portability
  • Warped Wafer Prevention
  • Sparking Prevention
  • Improved Chemical Resistance
  • Improved Productivity
  • Misalignment Prevention
  • Reduced Defect Rate
  • Improved Productivity(Improved Throughput)
  • Wear Resistance
  • Contact Damage Reduction
  • Yield Improvement
  • Man-Hour Reduction
  • Surface Resistance Control
  • Wear Prevention
  • Particle Control
  • Suction Mark Reduction
  • Outgassing Reduction
  • Deformation Reduction
  • Improved Plasma Resistance
  • Long Service Life
  • ワークの傷防止
  • Contamination Measures
  • Cost Reduction

Improved Functionality

Improved Productivity(Improved Throughput)

Man-Hour Reduction

Cost Reduction

  • Wafer Transfer End Effector / Handling Arm
  • Baking Setter
  • Porous Chuck
  • Alumina Cover
  • PAD
  • Other

Wafer Transfer End Effector / Handling Arm

CONTACT

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