Example of VA / VE proposals

CERAMICS DESIGN LAB > Measures against static electricity and outgas in wafer Transfer End Effector / Handling Arm

Measures against static electricity and outgas in wafer Transfer End Effector / Handling Arm

  • Problems
    Outgassing
    Heat Resistance
    Conductivity
    Static Electricity
  • Proposed Effect
    Improved Heat Resistance
    Anti-Static Measures
    Surface Resistance Control
    Outgassing Reduction
  • Product Type
    Wafer Transfer End Effector / Handling Arm

Customer's concerns and problems / Before

In the newly developed process, no outgas was generated under high temperatures, and a conductive transport End Effector / Handling Arm was required.


There was concern about outgas from the viewpoint of the coating material in the conventional conductive fluororesin coating specifications, but we did not find a suitable coating in many cases.

Our proposals and improvement effects / After

We proposed and evaluated ADB film, our original coating. We were able to satisfy all the requirements.


ADB film has a low surface-resistance even at high temperatures and is electrostatically dissipative.


It is also highly durable and can be used continuously for a long time.


With little outgassing, we were able to safely use it in new processes.

  • Measures against static electricity and outgas in wafer Transfer End Effector / Handling Arm|Ceramics Design Lab
  • Measures against static electricity and outgas in wafer Transfer End Effector / Handling Arm|Ceramics Design Lab
  • Measures against static electricity and outgas in wafer Transfer End Effector / Handling Arm|Ceramics Design Lab
  • Measures against static electricity and outgas in wafer Transfer End Effector / Handling Arm|Ceramics Design Lab

Point of the proposed example / Point

The point of this case is that the optimum selection of coating facilitates adaptation to new process environments.


Asuzac constantly develops state-of-the-art ceramics technologies, particularly in the semiconductor manufacturing industry, and offers solutions for issues such as outgas countermeasures.


The Fine Ceramics Division of ASUZAC Corporation, which operates the Ceramics Design Laboratory, handles everything from material development and preparation to design and manufacture, as well as surface treatment, inspection, and cleaning.


We can also offer our own coating-technology for adding functionality to ceramics materials, as well as the selection of materials such as ceramics materials with high heat resistance and conductivity, and high-purity alumina and SiC that are highly pure and prevent contamination.


If you have trouble with the existing wafer Transfer End Effector / Handling Arm, please feel free to contact us.

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Examples of VA/VE proposals
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  • Deformation
  • Cost
  • Particles
  • Conductivity
  • Suction Marks
  • Static Electricity
  • 大型偏光フィルムの吸着
  • Warped Wafer
  • Productivity (Throughput)
  • Impurities
  • Sparking
  • Wafer Scratching
  • Part Replacement Time
  • Outgassing
  • Surface Resistance
  • Wafer Sticking
  • Reflectance
  • Air-Permeability
  • Lint adhesion
  • Misalignment
  • Clogging
  • Plasma Resistance
  • Yield
  • Contact Damage
  • Product Life
  • Dust Emissions
  • Defect Rate
  • Heat Resistance
  • Contamination
  • Abrasion
  • Functionality
  • Chemical Resistance
  • Corrosion Resistance
  • 薄ウェハ

Part Replacement Time

薄ウェハ

  • 準備中です
  • Metal Contamination Control
  • Wear Resistance Improvement
  • Improved Functionality
  • Wafer Scratch Prevention
  • Anti-Static Measures
  • Improved Heat Resistance
  • Portability
  • Warped Wafer Prevention
  • Sparking Prevention
  • Improved Chemical Resistance
  • Improved Productivity
  • Misalignment Prevention
  • Reduced Defect Rate
  • Improved Productivity(Improved Throughput)
  • Wear Resistance
  • Contact Damage Reduction
  • Yield Improvement
  • Man-Hour Reduction
  • Surface Resistance Control
  • Wear Prevention
  • Particle Control
  • Suction Mark Reduction
  • Outgassing Reduction
  • Deformation Reduction
  • Improved Plasma Resistance
  • Long Service Life
  • ワークの傷防止
  • Contamination Measures
  • Cost Reduction

Improved Functionality

Improved Productivity(Improved Throughput)

Man-Hour Reduction

Cost Reduction

  • Wafer Transfer End Effector / Handling Arm
  • Baking Setter
  • Porous Chuck
  • Alumina Cover
  • PAD
  • Other

Wafer Transfer End Effector / Handling Arm

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