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CERAMICS DESIGN LAB > Wafer tray made of Alumina for dry etching (through hole type)

Wafer tray made of Alumina for dry etching (through hole type)

Wafer tray made of Alumina for dry etching (through hole type)|Ceramics Design Lab
Wafer tray made of Alumina for dry etching (through hole type)|Ceramics Design Lab
Wafer tray made of Alumina for dry etching (through hole type)|Ceramics Design Lab
Product Name Wafer tray made of Alumina for dry etching (through hole type)
Industry Semiconductor
Product Type Wafer Tray
Material High Purity Alumina
Size Dimensions Φ340 mm, Thickness 2.5 mm
This is an Alumina tray with a through-hole shape that holds a 4-inch wafer. Seven wafers with oriflers can be mounted on Φ340 x 2.5t. This is a tray that can receive wafers at about the outer peripheral 0.5mm of the wafer. We used our machining center to make a U-shaped notch with a width of 2.4 x a length of 3.2. Finished to a flatness of 0.05. We perform a full range of operations, from mixing, granulation, molding, raw processing, firing, secondary processing, and inspection of Alumina materials. Asuzac Corporation, which operates the Ceramics Design Lab, offers a full range of services from Alumina raw material preparation, granulation, and molding to green processing (raw processing), firing, secondary processing, inspection, and cleaning. In addition to wafer trays such as this product, we have a large number of experience in manufacturing ceramics products such as wafer Transfer End Effector / Handling Arm (including those developed in-house), suction chucks, and setters for sintering. For the design and manufacture of ceramics products for semiconductors and electronic components, leave it to Asuzac.

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