Transfer End Effector / Handling Arm for Wafer Prober Equipment (Suction and Bernoulli Integrated Type)

This is a transfer End Effector / Handling Arm used for wafer prober equipment. Our proprietary “hollow-integrated forming technology” provides both suction and Bernoulli flow paths for thickness 4.4mm. Using our machining center, we drilled the spouting holes with oblique angles of 22.5° and Φ0.5. In addition, a suction hole with a hole diameter of Φ0.5 x 160 is machined. The plane parallelism was finished to 0.05. Asuzac Corporation, which operates the Ceramics Design Lab, offers a full range of services from alumina raw material preparation, granulation, and molding to green processing (raw processing), firing, secondary processing, inspection, and cleaning. In addition to wafer Transfer End Effector / Handling Arm such as this product, we have a lot of experience in manufacturing wafer trays, suction chucks, setters for sintering, and other ceramics products. For the design and manufacture of ceramics products for semiconductors and electronic components, leave it to Asuzac.