For fine ceramic products such as Transfer End Effector / Handling Arm and Porous Chuck
made in Japan
＜Telephone quotations/inquiries＞
TEL+81-26-248-1626
Business hours: 9:00-17:00
(closed on Saturdays, Sundays and Holidays)
＜Telephone quotations/inquiries＞
TEL. +81-26-248-1626Business hours: 9:00-17:00 (closed on Saturdays, Sundays and Holidays)
＜Estimates and inquiries by FAX＞
FAX. +81-26-251-2160
「Improved Functionality」 list
- Search by Problem
- Search by Desired Effect
- Search by Product Type
- Deformation
- Cost
- Particles
- Conductivity
- Suction Marks
- Static Electricity
- 大型偏光フィルムの吸着
- Warped Wafer
- Productivity (Throughput)
- Impurities
- Sparking
- Wafer Scratching
- Part Replacement Time
- Outgassing
- Surface Resistance
- Wafer Sticking
- Reflectance
- Air-Permeability
- Lint adhesion
- Misalignment
- Clogging
- Plasma Resistance
- Yield
- Contact Damage
- Product Life
- Dust Emissions
- Defect Rate
- Heat Resistance
- Contamination
- Abrasion
- Functionality
- Chemical Resistance
- Corrosion Resistance
- 薄ウェハ
- Metal Contamination Control
- Wear Resistance Improvement
- Improved Functionality
- Wafer Scratch Prevention
- Anti-Static Measures
- Improved Heat Resistance
- Portability
- Warped Wafer Prevention
- Sparking Prevention
- Improved Chemical Resistance
- Improved Productivity
- Misalignment Prevention
- Reduced Defect Rate
- Improved Productivity(Improved Throughput)
- Wear Resistance
- Contact Damage Reduction
- Yield Improvement
- Man-Hour Reduction
- Surface Resistance Control
- Wear Prevention
- Particle Control
- Suction Mark Reduction
- Outgassing Reduction
- Deformation Reduction
- Improved Plasma Resistance
- Long Service Life
- ワークの傷防止
- Contamination Measures
- Cost Reduction
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2023.03.07Proposal for a transport End Effector / Handling Arm that can suck warped wafers
Product Type： Wafer Transfer End Effector / Handling Arm
Proposed Effect： Warped Wafer Prevention,Misalignment Prevention,Improved Functionality
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2022.12.05Proposal of a porous setter with low impact on the work piece and good air permeability
Product Type： Baking Setter
Proposed Effect： Contact Damage Reduction,Improved Functionality,Reduced Defect Rate,Yield Improvement
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2022.12.05Cost reduction by remodeling the wafer Transfer End Effector / Handling Arm -holding section to a PAD
Product Type： Wafer Transfer End Effector / Handling ArmPAD
Proposed Effect： Man-Hour Reduction,Cost Reduction,Improved Functionality,Improved Productivity,Wear Resistance
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2022.12.05Proposal for a Transfer End Effector / Handling Arm that can use one wafer for adsorption and floating
Product Type： Wafer Transfer End Effector / Handling Arm
Proposed Effect： Man-Hour Reduction,Cost Reduction,Improved Functionality,Improved Productivity
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2022.12.05Proposal for a portable wafer Transfer End Effector / Handling Arm
Product Type： Wafer Transfer End Effector / Handling Arm
Proposed Effect： Improved Functionality,Portability
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2022.12.05Proposal for a transport End Effector / Handling Arm that can suck warped wafers
Product Type： Wafer Transfer End Effector / Handling Arm
Proposed Effect： Warped Wafer Prevention,Misalignment Prevention,Improved Functionality,Yield Improvement
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2022.12.05Proposal of a wafer Transfer End Effector / Handling Arm with superior electrostatic diffusion effect even at high temperatures
Product Type： Wafer Transfer End Effector / Handling Arm
Proposed Effect： Improved Functionality,Anti-Static Measures,Surface Resistance Control
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2022.12.05Proposal for assembly of the sensor to the wafer Transfer End Effector / Handling Arm
Product Type： Wafer Transfer End Effector / Handling Arm
Proposed Effect： Improved Productivity(Improved Throughput),Improved Functionality
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2022.12.05
Proposal of double-sided suction Porous Chuck
Product Type： Porous Chuck
Proposed Effect： Improved Productivity(Improved Throughput),Man-Hour Reduction,Cost Reduction,Improved Functionality
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Searching for problems
- Deformation
- Cost
- Particles
- Conductivity
- Suction Marks
- Static Electricity
- 大型偏光フィルムの吸着
- Warped Wafer
- Productivity (Throughput)
- Impurities
- Sparking
- Wafer Scratching
- Part Replacement Time
- Outgassing
- Surface Resistance
- Wafer Sticking
- Reflectance
- Air-Permeability
- Lint adhesion
- Misalignment
- Clogging
- Plasma Resistance
- Yield
- Contact Damage
- Product Life
- Dust Emissions
- Defect Rate
- Heat Resistance
- Contamination
- Abrasion
- Functionality
- Chemical Resistance
- Corrosion Resistance
- 薄ウェハ
-
Look for the proposed effect
- Metal Contamination Control
- Wear Resistance Improvement
- Improved Functionality
- Wafer Scratch Prevention
- Anti-Static Measures
- Improved Heat Resistance
- Portability
- Warped Wafer Prevention
- Sparking Prevention
- Improved Chemical Resistance
- Improved Productivity
- Misalignment Prevention
- Reduced Defect Rate
- Improved Productivity(Improved Throughput)
- Wear Resistance
- Contact Damage Reduction
- Yield Improvement
- Man-Hour Reduction
- Surface Resistance Control
- Wear Prevention
- Particle Control
- Suction Mark Reduction
- Outgassing Reduction
- Deformation Reduction
- Improved Plasma Resistance
- Long Service Life
- ワークの傷防止
- Contamination Measures
- Cost Reduction
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Search from the product type
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CONTACT
The quotation and inquiries are available by the telephone /FAX or the mail .
TEL. +81-26-248-1626
FAX. +81-26-251-2160
