For fine ceramic products such as Transfer End Effector / Handling Arm and Porous Chuck
made in Japan
＜Telephone quotations/inquiries＞
TEL+81-26-248-1626
Business hours: 9:00-17:00
(closed on Saturdays, Sundays and Holidays)
＜Telephone quotations/inquiries＞
TEL. +81-26-248-1626Business hours: 9:00-17:00 (closed on Saturdays, Sundays and Holidays)
＜Estimates and inquiries by FAX＞
FAX. +81-26-251-2160
「Suction Marks」 list
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- Deformation
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- 大型偏光フィルムの吸着
- Warped Wafer
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- Impurities
- Sparking
- Wafer Scratching
- Part Replacement Time
- Outgassing
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- Metal Contamination Control
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- Anti-Static Measures
- Improved Heat Resistance
- Portability
- Warped Wafer Prevention
- Sparking Prevention
- Improved Chemical Resistance
- Improved Productivity
- Misalignment Prevention
- Reduced Defect Rate
- Improved Productivity(Improved Throughput)
- Wear Resistance
- Contact Damage Reduction
- Yield Improvement
- Man-Hour Reduction
- Surface Resistance Control
- Wear Prevention
- Particle Control
- Suction Mark Reduction
- Outgassing Reduction
- Deformation Reduction
- Improved Plasma Resistance
- Long Service Life
- ワークの傷防止
- Contamination Measures
- Cost Reduction
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2024.06.10大型偏光フィルムの吸着が可能な500角の大型多孔質チャックのご提案
Product Type： Porous Chuck
Proposed Effect： Deformation Reduction,Improved Productivity(Improved Throughput),Suction Mark Reduction,ワークの傷防止
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2023.08.08パワー半導体向け薄反りウエハの保持・吸着が可能な多孔質埋め込みハンドのご提案
Product Type： Wafer Transfer End Effector / Handling Arm
Proposed Effect： Wafer Scratch Prevention,Suction Mark Reduction
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2022.12.05
Proposal of End Effector / Handling Arm for warping and thin wafer transfer
Product Type： Wafer Transfer End Effector / Handling Arm
Proposed Effect： Wafer Scratch Prevention,Warped Wafer Prevention,Suction Mark Reduction,Yield Improvement,Particle Control
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Searching for problems
- Deformation
- Cost
- Particles
- Conductivity
- Suction Marks
- Static Electricity
- 大型偏光フィルムの吸着
- Warped Wafer
- Productivity (Throughput)
- Impurities
- Sparking
- Wafer Scratching
- Part Replacement Time
- Outgassing
- Surface Resistance
- Wafer Sticking
- Reflectance
- Air-Permeability
- Lint adhesion
- Misalignment
- Clogging
- Plasma Resistance
- Yield
- Contact Damage
- Product Life
- Dust Emissions
- Defect Rate
- Heat Resistance
- Contamination
- Abrasion
- Functionality
- Chemical Resistance
- Corrosion Resistance
- 薄ウェハ
-
Look for the proposed effect
- Metal Contamination Control
- Wear Resistance Improvement
- Improved Functionality
- Wafer Scratch Prevention
- Anti-Static Measures
- Improved Heat Resistance
- Portability
- Warped Wafer Prevention
- Sparking Prevention
- Improved Chemical Resistance
- Improved Productivity
- Misalignment Prevention
- Reduced Defect Rate
- Improved Productivity(Improved Throughput)
- Wear Resistance
- Contact Damage Reduction
- Yield Improvement
- Man-Hour Reduction
- Surface Resistance Control
- Wear Prevention
- Particle Control
- Suction Mark Reduction
- Outgassing Reduction
- Deformation Reduction
- Improved Plasma Resistance
- Long Service Life
- ワークの傷防止
- Contamination Measures
- Cost Reduction
-
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EXAMPLE OF CUSTOM-MADE
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operated by Asuzac Co., Ltd.
CONTACT
The quotation and inquiries are available by the telephone /FAX or the mail .
TEL. +81-26-248-1626
FAX. +81-26-251-2160
