Porous embedded End Effector / Handling Arm

Product Name	Porous embedded End Effector / Handling Arm
Classification	Adsorption End Effector / Handling Arm
Use	For wafer transport (atmospheric use)
Material	Adsorption part：Porous ceramics,Body：Alumina and SiC（Silicon Carbide）
Feature	Transfer of thin warped wafers is possible.　　 Hard to adsorb traces on wafers.
Size	12": 350 × 220 mm (outer dimension), 3.5 mm (thickness) 8": 280 × 140 mm (outer dimension), 3.5 mm (thickness)

Features Of This Product

Porous embedded hand is our original adsorption type hand.
The wafer adsorption part is porous ceramics.
The body can be made of alumina and silicon carbide.
Porous ceramics are embedded in the main body using adhesives.
The End Effector / Handling Arm is characterized by its resistance to adsorption marks on the wafer.
Thin and warped wafers can be adsorbed.

Features of "Porous embedded End Effector / Handling Arm"

Transfer of thin warped wafers is possible.　　
Hard to adsorb traces on wafers.
Narrow cassette pitch can be supported.

Shape of "Porous embedded End Effector / Handling Arm"

Figure 1 shows the appearance of a 12-inch porous embedded End Effector / Handling Arm with three porous locations to pick up and hold wafers.
Figure 2 shows the appearance of an 8-inch porous embedding End Effector / Handling Arm with three porous locations to pick up and hold wafers.
Figure 3 shows the A-A cross section of the porous hand (see Figures 1 and 2). Porous ceramics are bonded to the main body with adhesive.

Examples and achievements of "Porous embedded End Effector / Handling Arm"

2022.12.05
Proposal of End Effector / Handling Arm for warping and thin wafer transfer

Product Type: Wafer Transfer End Effector / Handling Arm

Proposed Effect: Wafer Scratch Prevention,Warped Wafer Prevention,Suction Mark Reduction,Yield Improvement,Particle Control

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Frequently Asked Questions on "Porous embedded End Effector / Handling Arm"

I am transferring wafers using a End Effector / Handling Arm with suction hole specifications, but the suction pressure dents the wafers.

The porous embedded End Effector / Handling Arm holds the wafer with a porous suction.Therefore, deformation of the wafer during suction can be minimized.
We are applying protective tape to the surface of a semiconductor wafer when polishing or etching the backside of the wafer.We are having trouble with suction marks on the tape during transport.

We propose a porous embedded End Effector / Handling Arm.Porous is less prone to adsorption marks on the tape compared to suction holes or resin pads due to its microporous nature.
Do you use adhesives for porous embedded End Effector / Handling Arm?

Yes, we use an adhesive. Adhesive is used to bond the body and the porous material.
Is it possible to manufacture porous embedded hands for wafer sizes other than 12" and 8"?

Yes, we can manufacture porous embedding hands for 4-inch, 5-inch, and 6-inch wafers.Please contact us for details.
Can the porous embedded End Effector / Handling Arm perform inverted transfers?

Yes, the wafer is held by the three porous parts.
Due to the layout of the equipment, there are restrictions on hand width and thickness due to clearances. Is it possible to design the hand to fit the clearance of the equipment?

Yes, it is possible. We will make a design proposal according to the shape of the equipment. Please contact us for details.