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PeriZac® Peripherally Gripping End Effector / Handling Arm

PeriZac® Peripherally Gripping End Effector / Handling Arm|Ceramics Design Lab
Product Name PeriZac® Peripherally Gripping End Effector / Handling Arm
Classification Outer circumference 3mm adsorption type standard End Effector
Use For wafer transport (atmospheric use)
Material High Purity Alumina
Feature Capable of suction within 3mm of wafer circumference   
Use of a material that does not damage the workpiece 
Use of a guide made of a material that is resistant to damage to the workpiece
Enables thinner wafers
Size 12": 350 x 220 mm (outer dimension), 2.5 mm (thickness)     
8": 272 x 100 mm (outer dimension), 2.5 mm (thickness)

Features Of This Product

PeriZac® is our original End Effector / Handling Arm that picks up a wafer with four guides around its periphery.The wafer can be held within 3 mm from the outer edge of the wafer, which reduces particles from the wafer bevel and backside compared to conventional wafer transfer with guides,This reduces the generation of particles from the wafer bevel and backside compared to conventional guided transfer.The guides are made of a material that is resistant to damage to the workpiece.The integrated cavity technology enables a thinner wafer. It is not easy to flex and has excellent durability.

Features of "PeriZac® Peripherally Gripping End Effector / Handling Arm"

  • PeriZac® Peripherally Gripping End Effector / Handling Arm|Ceramics Design Lab
    ・Capable of suction within 3mm of wafer circumference   
    ・Use of a material that does not damage the workpiece 
    ・Use of a guide made of a material that is resistant to damage to the workpiece
    ・Enables thinner wafers

Shape of "PeriZac® Peripherally Gripping End Effector / Handling Arm"

  • PeriZac® Peripherally Gripping End Effector / Handling Arm|Ceramics Design Lab
    ・Capable of suction within 3mm of outer circumference
    ・Particles generated from wafer bevels and backside of wafers by contact are suppressed.
    ・Guide is made of a material that is less likely to damage wafers
    ・Cavity integration technology enables thinner wafer.
    ・Available to change mounting holes, root length, and width.
    ・Options such as sensor mounting are available.

Download Drawings of"PeriZac® Peripherally Gripping End Effector / Handling Arm"

PeriZac8-inch|Ceramics Design Lab

PeriZac8-inch

(PeriZac8-inch)

  • Particle suppression
  • Improved durability
  • Adsorption type
  • Deflection
  • Metal-free
  • For Atmospheric
  • Thinner
  • Guide
  • Integrated cavity

Capable of holding wafers within 3mm of wafer circumference

PeriZac12-inch|Ceramics Design Lab

PeriZac12-inch

(PeriZac12-inch)

  • Particle suppression
  • Improved durability
  • Adsorption type
  • Deflection
  • Metal-free
  • For Atmospheric
  • Thinner
  • Guide
  • Integrated cavity

Capable of holding wafers within 3mm of wafer circumference

Frequently Asked Questions on "PeriZac® Peripherally Gripping End Effector / Handling Arm"

  • Does not contact the sides of the wafer. The bottom of the wafer is adsorbed by 4 guides.

  • Since the heat resistance temperature of the guide is 200°C, it is difficult to use it at higher temperatures.If the product is to be used in high temperature environments, we will propose an alumina-integrated shape for the protruding part that replaces the guide.Please contact us for details.

  • Reversible motion is possible; the workpiece is held in place even when reversed because the workpiece is held by the four guides.

  • Production is possible; we can produce for 4inch, 5inch, and 6inch wafers.Please contact us for details.

CONTACT

The quotation and inquiries are available by the telephone /FAX or the mail .