I would like to transfer and carry out the wafer manually.
Yes, it is possible.As an example of improvement, some customers attach metal arms to their hands and use them to transport and unload wafers.
Depending on the thickness of the wafer and the amount of warpage, our Bernoulli End Effector / Handling Arm and Porous End Effector / Handling Arm are available as measures against warped wafers.
Wafers can be checked and tested for transport at our Robot Test Center. Please contact us if you have any problems.
>>Here is an example of VA / VE suggestions
With a Porous Chuck, it is difficult to adsorb paper or Japanese paper.
A material with an uneven surface leaks from there, making it difficult to adsorb.
For example, it may be possible to press a work piece against the Porous Chuck while air is being sucked, or to suck depending on the thickness and surface condition of the suctioning target, so please try a demonstration machine.
>>Apply for the Porous Chuck demo here.
We will propose wave and V-shaped setters.The V-shaped setter can be manufactured with external 140 mm×100 mm, thickness 8 mm, V-shaped angle 112.6°, and pitch 120 mm(P12×10. The reaction between the setter and the work piece can be minimized by placing the work piece on the wave-shaped or V-shaped setter and firing.As dummy wafers, we have a proven track record in manufacturing with alumina and alumina (our original material). Alcema has a 2.41g/cm specific gravity of ^3, which is close to the specific gravity of silicon wafers, making them easy to handle. Each can be manufactured on an inch-by-inch basis to suit your use, and the required dimensions such as 0.3mm and 0.7mm are available.
