DRAWING DOWNLOAD

CERAMICS DESIGN LAB > DRAWING DOWNLOAD

DRAWING DOWNLOAD

You can download 2D and 3D drawing files of wafer transfer hands in dwg format or STEP format (multiple selections are possible).
We hope you find it useful.

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  • LeviZac12-inch|Ceramics Design Lab

    LeviZac12-inch

    (LeviZac12-inch)

    • Warped wafer
    • Thin wafer
    • Flotation type
    • Bernoulli equation
    • Heat resistance
    • For Atmospheric
    • Spouting hole
    • Guide
    • Integrated cavity

    Capable of holding wafers within 3mm of wafer circumference

  • LeviZac8-inch|Ceramics Design Lab

    LeviZac8-inch

    (LeviZac8-inch)

    • Warped wafer
    • Thin wafer
    • Flotation type
    • Bernoulli equation
    • Heat resistance
    • For Atmospheric
    • Spouting hole
    • Guide
    • Integrated cavity

    Capable of holding wafers within 3mm of wafer circumference

  • I Type LeviZac4-inch|Ceramics Design Lab

    I Type LeviZac4-inch

    (I Type LeviZac4-inch)

    • Warped wafer
    • Thin wafer
    • Flotation type
    • Bernoulli equation
    • Heat resistance
    • For Atmospheric
    • Spouting hole
    • Guide
    • Integrated cavity

    8 guides allow wafer retention

  • Thin-LeviZac4-inch|Ceramics Design Lab

    Thin-LeviZac4-inch

    (Thin-LeviZac4-inch)

    • Warped wafer
    • Thin wafer
    • Flotation type
    • Bernoulli equation
    • Heat resistance
    • For Atmospheric
    • Spouting hole
    • Guide
    • Integrated cavity

    Capable of holding wafers within 3mm of wafer circumference

  • Thin-LeviZac4-inch|Ceramics Design Lab

    Thin-LeviZac4-inch

    (Thin-LeviZac4-inch)

    • Warped wafer
    • Thin wafer
    • Flotation type
    • Bernoulli equation
    • Heat resistance
    • For Atmospheric
    • Spouting hole
    • Guide
    • Integrated cavity

    Capable of holding wafers within 3mm of wafer circumference

  • Thin-LeviZac4-inch|Ceramics Design Lab

    Thin-LeviZac4-inch

    (Thin-LeviZac4-inch)

    • Warped wafer
    • Thin wafer
    • Flotation type
    • Bernoulli equation
    • Heat resistance
    • For Atmospheric
    • Spouting hole
    • Guide
    • Integrated cavity

    Can be transported to narrow cassette widths

  • PeriZac12-inch|Ceramics Design Lab

    PeriZac12-inch

    (PeriZac12-inch)

    • Particle suppression
    • Improved durability
    • Adsorption type
    • Deflection
    • Metal-free
    • For Atmospheric
    • Thinner
    • Guide
    • Integrated cavity

    Capable of holding wafers within 3mm of wafer circumference

  • PeriZac8-inch|Ceramics Design Lab

    PeriZac8-inch

    (PeriZac8-inch)

    • Particle suppression
    • Improved durability
    • Adsorption type
    • Deflection
    • Metal-free
    • For Atmospheric
    • Thinner
    • Guide
    • Integrated cavity

    Capable of holding wafers within 3mm of wafer circumference

  • UniZac-air12-inch|Ceramics Design Lab

    UniZac-air12-inch

    (UniZac-air12-inch)

    • Adhesive-free
    • Improved durability
    • Adsorption type
    • Heat resistance
    • Metal-free
    • For Atmospheric
    • Thinner
    • High strength
    • Integrated cavity

    Effective for organic-based outgas control

  • UniZac-air8-inch|Ceramics Design Lab

    UniZac-air8-inch

    (UniZac-air8-inch)

    • Adhesive-free
    • Improved durability
    • Adsorption type
    • Heat resistance
    • Metal-free
    • For Atmospheric
    • Thinner
    • High strength
    • Integrated cavity

    Effective for organic-based outgas control

  • UniZac-air8-inch(1mm thickness type)|Ceramics Design Lab

    UniZac-air8-inch(1mm thickness type)

    (UniZac-air8-inch(1mm thickness type))

    • Adhesive-free
    • Improved durability
    • Adsorption type
    • Heat resistance
    • Metal-free
    • For Atmospheric
    • Thinner
    • High strength
    • Integrated cavity

    1 mm thick cavity integrated transfer End Effector

  • UniZac-air8″(ASiC)(1.9mm thickness type)(ASUZAC LOGO)|Ceramics Design Lab

    UniZac-air8″(ASiC)(1.9mm thickness type)(ASUZAC LOGO)

    (UniZac-air8")

    • Adhesive-free
    • Improved durability
    • Adsorption type
    • Heat resistance
    • Metal-free
    • For Atmospheric
    • Thinner
    • High strength
    • Integrated cavity

    1.9mm thick SiC cavity integrated transfer End Effector

  • UniZac-air8″(ASiC)(1.9mm thickness type)(with mounting holes)|Ceramics Design Lab

    UniZac-air8″(ASiC)(1.9mm thickness type)(with mounting holes)

    (UniZac-air8")

    • Adhesive-free
    • Improved durability
    • Adsorption type
    • Heat resistance
    • Metal-free
    • For Atmospheric
    • Thinner
    • High strength
    • Integrated cavity

    1.9mm thick SiC cavity integrated transfer End Effector

  • UniZac-Obon12-inch|Ceramics Design Lab

    UniZac-Obon12-inch

    (UniZac-Obon12-inch)

    • Short delivery time
    • Improved durability
    • Tray type
    • Heat resistance
    • For Atmospheric
    • For vacuum
    • Deflection
    • High strength
    • Light weight

    Reduced weight and thickness

  • UniZac-Obon8-inch|Ceramics Design Lab

    UniZac-Obon8-inch

    (UniZac-Obon8-inch)

    • Short delivery time
    • Improved durability
    • Tray type
    • Heat resistance
    • For Atmospheric
    • For vacuum
    • Deflection
    • High strength
    • Light weight

    Reduced weight and thickness

  • UniZac-Obon4-inch|Ceramics Design Lab

    UniZac-Obon4-inch

    (UniZac-Obon4-inch)

    • Short delivery time
    • Improved durability
    • Tray type
    • Heat resistance
    • For Atmospheric
    • For vacuum
    • Deflection
    • High strength
    • Light weight

    Reduced weight and thickness

  • Porous embedded hand12-inch|Ceramics Design Lab

    Porous embedded hand12-inch

    (Porous embedded hand12-inch)

    • Warped wafer
    • Thin wafer
    • Deformation prevention
    • Adsorption scar suppression
    • Adsorption type
    • Porousbuilt-in
    • For Atmospheric
    • Breathability
    • Responsiveness

    Capable of retaining lightly warped wafers

  • Porous embedded hand8-inch|Ceramics Design Lab

    Porous embedded hand8-inch

    (Porous embedded hand8-inch)

    • Warped wafer
    • Thin wafer
    • Deformation prevention
    • Adsorption scar suppression
    • Adsorption type
    • Porousbuilt-in
    • For Atmospheric
    • Breathability
    • Responsiveness

    Capable of retaining lightly warped wafers

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