Is it possible to bond ceramics together?
We have two types of bonding, one using adhesive and the other diffusion bonding.There are organic and inorganic adhesives, each of which can be proposed according to the user’s environment.
Diffusion bonding is available only for the specific material (silicon carbide) at present, and may not be available depending on the shape.The surface roughness depends on the material and processing method.
For example, when machining with a surface grinder, alumina is about Ra1.6 and silicon carbide is about Ra0.4.
Fine ceramics are basically machined using diamond tools, but they vary depending on the state of the tool and the machining conditions, making it difficult to control the surface roughness.
If you want to roughen the surface, there are some methods such as changing the machining tools and conditions or blasting.
If you want to polish the surface, you can use buffing or lapping.Although it depends on the shape and material, we have a proven track record in processing thinness of 0.3 mm using our surface grinders. Care must be taken when thinning because it tends to crack or warp due to residual stress.Yes, it is possible. F/f/H/h standards are available. In addition to through holes and track shapes, deep counter bore shapes are also available. Depending on the height (depth), there may be cases where the effective depth occurs with the hole. F and H standards are available for holes. Positioning can also be used by customers with problems.Grooving is possible.
However, because it is difficult to groove the pin angle, it becomes R-shaped.
Basically, it can be processed in the same way as dense ceramics, but porous ceramics are brittle, so some are difficult depending on the product size and processing content.
If there is anything you would like to make, please contact us for more information. For the corners that are most likely to be chipped, we recommend C-face or R-chamfering.
We also perform C-chamfering (about 0.2 to 0.3) and R-chamfering.
In addition, the C chamfer C1 is recommended for the mouth of the hole to prevent chipping and cracking at the mouth.
In addition, depending on the material and shape, there may be cracks caused by thermal shock, so expert staff can propose materials and propose them according to the product.
Please contact us for more information.Possible.
We apply screw processing directly to the ceramics, and also apply heli-insert tangles.
In addition, we also provide adhesive support for metal bushes, so we will respond to the customer’s application.
Torque tests are also conducted on the screws after processing and assembly. Coarse and fine threads can also be handled.
Please contact us for more information.
Our original technology for creating cavities inside in one piece.
Normally, the flow path for adsorption is manufactured by the lamination method. Cavity generation is possible without lamination in the cavity integral.
There is no risk of leakage due to the lack of adhesive.
It is also effective for use at high temperatures, as well as for measures against outgassing and dust adhesion.
Longer life compared to laminating.
Please see the following pages for details.
>>Details of cavity molding techniques are given here.
We can do this for our materials.We can also handle surface treatment such as coating and blasting from the general details such as additional drilling of holes and counter bores.
If you consult with us about problems and problems with the products you are currently using, we can propose them regardless of whether they are newly manufactured or additionally manufactured. The thinnest 1 mm is available, depending on the material and configuration.
We are able to process 0.05 mm in terms of parallelism for alumina-based materials of Φ200mm x thickness 2 mm. As it varies depending on the size, thickness and material, please contact us for details.
